2015(10):77-81.
Abstract:
The spreading thermal resistance caused by the area difference between the electronic device and the cooling plate is significantly high when the heat flux density is higher than 100 W/ cm2 . In this paper, the thermal spreading resistance of the solid-
state T/ R module cold plate was modeled and simulated with a simplified analytical method, and then the effect of heat transfer coefficient, thickness, radius, heat transfer coefficient of the cold plate was studied. The optimal combination of parameters, such as, the radius and the thickness was obtained, with which the spreading thermal resistance and the total heat transfer resistance was minimum. Finally, the present model was validated with a CFD simulation, with a reasonable match obtained, which proved the present work as a solid reference of relevant applications